Samsung CP45FV component placement machine. 18,900 CPH (manufacturers figure)
Front and rear operation as standard
Board Size :
Min 50mm x 30mm x .38mm
Max 460mm x 400mm x 4.2mm
Vision consist of both fixed and flying systems, accuracy, chip (mm) +/-0.1, QFP =/-0.04 Max chip size 55 x 55.
Applicable components are 0603,1005, TR MELF, Tantalum, ALEC, SOP, PLCC, QFP (0.8P, 0.65P, 0.5P), PBGA, CBGA, TBGA, CSP, Connector.
Samsung SM482 component placement machine.
Manufacturer quotes 27000 placements per hour
Front and rear operation as standard.
27000 placements per hour (manufacturers figure)
This machine can fit Odd shape compoenents using the Connector/Polygon software option.
High Accuracy ±30µ@3σ/QFP, ±40µ@3σ/Chip Camera
Board Size :
Min : 50mm(x-axis) x 30mm (y-axis)
Max: 460mm (x)x400mm (y) (Optional size up to 1200mm length)
Max Factory Option: 510mm (x) x 460mm (y)
PCB Thickness :
Min: 0.38mm
Max: 4mm
Part Data :
Maximum Number of steps 30,000 (placements per board). Max components per program 120
Scan speed >100000 components /hr. 7500 tasks/min.
9 x 1.3 Megapixel CCD Cameras.
Min Component Size 0603
PCB Size Min110mm x 63mm. Max 457mmx508mm.
Checks for Missing ,Polarity, Tombstone, Billboard, Flipped, Wrong Part, Component Damage, Excess and Insufficient Solder and Debris on PCB.
Solder paste printer.
PCB Size: 50 x 50 ~ 550 x 400mm
PCB Thickness: 0.3mm ~ 5mm
Printing Time: 6sec / 11~12sec cycle excluding cleaning
Alignment Accuracy: ±0.015mm
Repeatability: ±0.0125mm
2D Inspection
Under Stencil Cleaning Wet/Dry/Vacuum
Ersa Hotflow 3 PC controlled oven for solder paste re-flow and adhesive curing on surface mount boards.
Min: 40mm
Max: 400mm
Max : 415-420mm (with support bars removed
For the setting of board profiles for optimum re-flow soldering performance.
JBC 6040 Hot Air Desoldering station for removing surface mount components.
